The equipment and facilities available to the ISET for SMT production are at the forefront technologically and able to meet any need.

MPM SCREEN SPEEDLINE UPM2000HIE

Board Size: 550X430mm
Automatic centering system
2D inspection system for any type of component
Automatic cleaning system with solvent extraction
Pc controller
System SMEMA

CHIP shouter JUKI FX-1R

Board Size: 420x370mm
Assembly components from 0201 up to 20x20mm
Accuracy 0.05mm (3 Sigma)
Speed 25,000 cp / h (IPC)
Equipped with multi-nozzle alignment system with high-resolution laser

PICK&PLACE JUKI KE-2060RL

Board Size: 500x370mm
Assembly components from 0201 up to 75x75mm (BGA, mBGA, fine pitch 0.3 mm pitch, etc.)
Accuracy 0.03mm (3 Sigma)
Speed 12,500 cp / h (IPC)
Equipped with laser alignment system and high-resolution Vision

OVEN Vitronics Soltec MOD.7038

Forno per saldatura a rifusione dotato:
7 heating zones top and bottom
3 cooling zones top and bottom
Knitted chain conveyor
Installation for welding NITROGEN
System SMEMA
PC controller

OVEN SPEEDLINE OMNIFLO 7

Oven for reflow soldering with:
7 heating zones top and bottom
3 cooling zones top and bottom
Knitted chain conveyor
System SMEMA
PC controller

AUTOMATIC INSPECTION MACHINE Orbotech TRION 2340

Board Size: 500x370mm
Inspection SMT components side TOP and BOTTOM side
Equipped with 13 cameras in high-resolution 5 and 24 flashes that provide 18-way lighting.
Equipped with a repair station with laser-guided online for analysis and repair defects.

CONCEPTRONIC FREEDOM SERIES 2000 HGR

Board Size: 500x370mm
Machine that can reprocess with high precision BGA, Fine Pitch and microBGA
Independent adjustment of top and bottom heaters
Software Detection temperature profile with 4 independent thermocouples